Fabrication of laser diode array

Semiconductor device manufacturing: process – Making device or circuit emissive of nonelectrical signal – Packaging or treatment of packaged semiconductor

Reexamination Certificate

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C438S051000

Reexamination Certificate

active

10706706

ABSTRACT:
A process of making a laser diode device includes these steps: applying a bonding layer such as molybdenum manganese to surfaces of first and second bodies of dielectric material such as beryllium oxide; joining the first and second bodies together to form a cavity; and bonding a sectored conductor ring to the bonding layer within the cavity.

REFERENCES:
patent: 5627850 (1997-05-01), Irwin et al.

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