Etching a substrate: processes – Forming or treating thermal ink jet article
Patent
1994-10-14
1995-08-15
Powell, William
Etching a substrate: processes
Forming or treating thermal ink jet article
216 41, 216 52, 216 99, G01D 1500, B44C 122
Patent
active
054415934
ABSTRACT:
An ink fill slot can be precisely manufactured in a substrate utilizing photolithographic techniques with chemical etching, plasma etching, or a combination thereof. These methods may be used in conjunction with laser ablation, mechanical abrasion, or electromechanical machining to remove additional substrate material in desired areas. The ink fill slots are appropriately configured to provide the requisite volume of ink at increasingly higher frequency of operation of the printhead by means of an extended portion that results in a reduced shelf length and thus reduced fluid impedance imparted to the ink. The extended portion is precisely etched to controllably align it with other elements of the printhead.
REFERENCES:
patent: Re32572 (1988-01-01), Hawkins et al.
patent: 4601777 (1986-07-01), Hawkins et al.
patent: 4612554 (1986-09-01), Polesbuk
patent: 4638337 (1987-01-01), Torpey et al.
patent: 4789425 (1988-12-01), Drake et al.
patent: 4808260 (1989-02-01), Sickafus et al.
patent: 4829324 (1989-05-01), Drake et al.
patent: 4851371 (1989-07-01), Fisher et al.
patent: 4863560 (1989-09-01), Hawkins
patent: 4875968 (1989-10-01), O'Neill et al.
patent: 4882595 (1989-11-01), Trueba et al.
patent: 4899178 (1990-02-01), Tellier
patent: 4899181 (1990-02-01), Hawkins et al.
patent: 4961821 (1990-10-01), Drake et al.
patent: 5160577 (1992-11-01), Deshpande
patent: 5277754 (1994-01-01), Hadimioglu et al.
patent: 5308442 (1994-05-01), Taub et al.
K. E. Bean, "Anisotropic Etching of Silicon", in IEEE Transactions On Electron Devices, vol. ED-25, No. 10, pp. 1185-1192 (Oct. 1978).
K. L. Petersen, "Silicon As A Mechanical Material", in Proceedings Of The IEEE, vol. 70, No. 5, pp. 420-457 May (1982).
E. Bassous, "Fabrication Of Novel Three-Dimensional Microstructures By The Anisotropic Etching Of (100) and (110) Silicon", in IEEE Transactions On Electron Devices, vol. ED-25, No. 10, pp. 1178-1185 (Oct. 1978).
Baughman Kit C.
Kahn Jeffrey A.
McClelland Paul H.
Tappon Ellen R.
Trueba Kenneth E.
Hewlett-Packard Corporation
Powell William
LandOfFree
Fabrication of ink fill slots in thermal ink-jet printheads util does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Fabrication of ink fill slots in thermal ink-jet printheads util, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Fabrication of ink fill slots in thermal ink-jet printheads util will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-2179117