Fabrication of hybrid semiconductor devices

Details Fabrication of hybrid semiconductor devices Fabrication of hybrid semiconductor devices

1994-07-12

1996-01-16

Ramsey, Kenneth J.

Metal fusion bonding

Process

Metal to nonmetal with separate metallic filler

29827, 29856, H01L 2160

Patent

active

054840970

ABSTRACT:
Two phase bridge rectifiers are fabricated starting with three lead flames and bonding a first pair of semiconductor chips on mounting pads of a first of the frames and a second pair of semiconductor chips on mounting pads of a second of the frames. The frames are then disposed one on top of the other with upper surfaces of the first pair of chips contacting under surfaces of the mounting pads of the second frame and with upper surfaces of the second pair of chips contacting under surfaces of a pair of mounting pads on the third frame. A mounting pad on the third (upper) frame includes an extension thereof extending downwardly and bonded to a terminal formed in the second (middle) frame, and a mounting pad on the first (lower) frame includes an extension thereof extending upwardly and bonded to another terminal of the second frame.

REFERENCES:
patent: 4288912 (1981-09-01), Wills et al.
patent: 4801765 (1989-01-01), Moyer et al.
patent: 5281556 (1994-01-01), Shimizu et al.

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