Coating processes – Electrical product produced – Integrated circuit – printed circuit – or circuit board
Patent
1981-07-27
1983-02-15
Smith, John D.
Coating processes
Electrical product produced
Integrated circuit, printed circuit, or circuit board
156664, 204192SP, 427 99, 427101, 427 79, 427 80, 501 20, H05K 312
Patent
active
043741592
ABSTRACT:
A method of fabricating film circuits whereby thick film crossunders may be included with thin film capacitors (22) on a single substrate (10). At least one dielectric layer (12) is formed on the crossunder electrode (11) and a layer capable of smoothing irregularities (13) is also formed in the area of capacitor formation. Firing of the capacitor underlayer is compatible with the dielectric layer. A layer such as beta tantalum (14) is formed over essentially the entire circuit and etched from the contact areas (21) of the crossunder electrode. The layer is oxidized to form a protective layer (15) for the previously deposited layers as well as an underlay for subsequently formed thin film components.
REFERENCES:
patent: 3317653 (1967-05-01), Layer, Jr. et al.
patent: 3560256 (1971-02-01), Abrams
patent: 3607679 (1971-09-01), Melroy
patent: 4031272 (1977-06-01), Khanna
patent: 4241103 (1980-12-01), Ohkubo et al.
patent: 4251326 (1981-02-01), Arcidiacono et al.
Abe et al., "Development of the Thick-Film Capacitor and Its Application for Hybrid Circuit Modules," IEEE Transactions on Components, Hybrids, and Manufacturing Tech., vol. CHMT-2, No. 4, Dec. 1979.
Pitetti Raymond C.
Rutkiewicz John
Bell Telephone Laboratories Incorporated
Birnbaum Lester H.
Smith John D.
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