Electrolysis: processes – compositions used therein – and methods – Electrolytic coating – Coating selected area
Reexamination Certificate
2005-12-06
2005-12-06
Wong, Edna (Department: 1753)
Electrolysis: processes, compositions used therein, and methods
Electrolytic coating
Coating selected area
C205S118000, C205S123000, C205S157000, C205S162000, C205S164000
Reexamination Certificate
active
06972081
ABSTRACT:
A process for fabricating a vertical spiral inductor within a multichip module package is disclosed. The process consists of depositing a pattern of bottom lines by electroplating copper on a substrate and then depositing an insulation pattern. Next, depositing a pattern of permeable material to form a core and then depositing polyimide to define vias and permeable core insulation. The vias are filled by electroplating copper. The vertical spiral inductor is formed and defined by next depositing a pattern of top metal (e.g. copper) lines by electroplating wherein the top metal lines are staggered with respect to the bottom metal lines. Lastly a top protective layer is deposited. The core is made from a permeable or non-permeable material.
REFERENCES:
patent: 5391517 (1995-02-01), Gelatos et al.
patent: 5674787 (1997-10-01), Zhao et al.
patent: 5891513 (1999-04-01), Dubin et al.
patent: 5936298 (1999-08-01), Capocelli et al.
patent: 6116863 (2000-09-01), Ahn et al.
patent: 6180261 (2001-01-01), Inoue et al.
patent: 6355153 (2002-03-01), Uzoh et al.
patent: 2004/0178492 (2004-09-01), Tsukamoto et al.
Merriam-Webster Online Dictionary (2 printouts).
Oliff & Berridg,e PLC
Wong Edna
LandOfFree
Fabrication of embedded vertical spiral inductor for... does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Fabrication of embedded vertical spiral inductor for..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Fabrication of embedded vertical spiral inductor for... will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-3498389