Fabrication of electronic components having a hollow package str

Details Fabrication of electronic components having a hollow package str Fabrication of electronic components having a hollow package str

1997-09-08

2000-12-26

Chaudhuri, Olik

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Including adhesive bonding step

438125, H01L 2144

Patent

active

061658162

ABSTRACT:
A process for fabricating an electronic component having a hollow packaging structure comprises the steps of: (a) printing an organic polymeric material on at least a portion of a main surface of a ceramic substrate where a ceramic lid is to be bonded and curing the printed organic polymeric material to form a cured product; (c) hermetic sealing the ceramic lid on a surface of the cured product with an organic bonding agent; and preferably (b) irradiating ultraviolet rays onto a surface of said cured product to form activated bonding sites between said steps (a) and (c). According to the process, a hollow package mounted with an electronic component can be fabricated efficiently.

REFERENCES:
patent: 3308525 (1967-03-01), Tsuji et al.
patent: 4987008 (1991-01-01), Yamazaki et al.
patent: 5078831 (1992-01-01), Miyazaki et al.
patent: 5412002 (1995-05-01), Enomoto et al.
patent: 5742007 (1998-04-01), Kornowski et al.
patent: 5818094 (1998-10-01), Matsuo

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