Fabrication of electrical conductor by replacement of metallic p

Details Fabrication of electrical conductor by replacement of metallic p Fabrication of electrical conductor by replacement of metallic p

1980-12-29

1983-09-13

Smith, John D.

Coating processes

Electrical product produced

Integrated circuit, printed circuit, or circuit board

427 98, 427101, 427102, 427103, 427123, 427205, 427436, H05K 312, H05K 318

Patent

active

044042370

ABSTRACT:
A low-cost conductor, e.g. a printed circuit, is prepared by applying a mixture of a metallic powder and polymer on a substrate and curing the polymer, followed by an augmentation replacement reaction being effected to replace some of the metallic powder with a more noble metal in such a way that the total volume of deposited metal on the surface exceeds that of the original metal powder at that surface. This procedure produces contiguous layer of conducting metal on the substrate. The conductors thus formed can easily be soldered without leaching using a conventional tin-lead solders.

REFERENCES:
patent: 3226256 (1965-12-01), Schweble
patent: 3332860 (1967-07-01), Diebold
patent: 3576662 (1971-04-01), Diebold
patent: 3764280 (1973-10-01), Lupinski
patent: 3801364 (1974-04-01), Kojima
patent: 4284665 (1981-08-01), Heimala et al.
Krulik, "Electroless Plating of Plastics", Journal of Chemical Education, vol. 55, No. 6, Jun. 1978, p. 361.

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