Coating processes – Electrical product produced – Integrated circuit – printed circuit – or circuit board
Patent
1994-07-01
1996-08-13
Beck, Shrive
Coating processes
Electrical product produced
Integrated circuit, printed circuit, or circuit board
427 96, 427 98, 427437, 205125, 205133, 205183, 205 80, 156150, B05D 512, C25D 502
Patent
active
055454291
ABSTRACT:
The present invention is directed to a process of a method for the full metallization of thru-holes in a polymer structure comprising the steps of applying a film-forming amount of a conductive polymer-metal composite paste to a metal cathode; bonding a patterned polymer structure to said paste; subjecting said polymer structure to an electrolytic plating bath for a time sufficient to fully metallize thru-hole surfaces in said patterned polymer structure and removing the structure from the cathode assembly. The fully metallized thru-hole polymer structure can then be cleaned and polished to produce a finished product.
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Booth Richard B.
Cooper Emanuel I.
Giess Edward A.
Kordus Mark R.
Krongelb Sol
Beck Shrive
International Business Machines - Corporation
Talbot Brian K.
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