Fabrication of double side fully metallized plated thru-holes, i

Coating processes – Electrical product produced – Integrated circuit – printed circuit – or circuit board

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427 96, 427 98, 427437, 205125, 205133, 205183, 205 80, 156150, B05D 512, C25D 502

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active

055454291

ABSTRACT:
The present invention is directed to a process of a method for the full metallization of thru-holes in a polymer structure comprising the steps of applying a film-forming amount of a conductive polymer-metal composite paste to a metal cathode; bonding a patterned polymer structure to said paste; subjecting said polymer structure to an electrolytic plating bath for a time sufficient to fully metallize thru-hole surfaces in said patterned polymer structure and removing the structure from the cathode assembly. The fully metallized thru-hole polymer structure can then be cleaned and polished to produce a finished product.

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