Fabrication of dense parallel solder bump connections

Details Fabrication of dense parallel solder bump connections Fabrication of dense parallel solder bump connections

1993-09-13

1995-04-18

Arbes, Carl J.

Metal working

Method of mechanical manufacture

Electrical device making

29843, 22818022, H05K 334

Patent

active

054067014

ABSTRACT:
A method and product are disclosed in which multiple solder bumps on a first planar surface are guided into engagement with terminals on a second planar surface by means of holes formed (by a photolithographic process) in a dielectric layer, which has been added to the second surface to provide the holes (or sockets) through which the solder bumps (or plugs) extend. The perforated (hole-providing) layer may be formed of one of several materials. The preferred perforated layer material is a photo-definable polyimide, which is hardened by heating after the holes have been formed. Small solder bumps may be formed inside the holes on the second surface, in order to facilitate bonding between the solder bumps on the first surface and the terminals on the second surface.

REFERENCES:
patent: 3392442 (1968-07-01), Napier et al.
patent: 3436818 (1969-04-01), Merrin et al.
patent: 3486223 (1969-12-01), Butera
patent: 4617730 (1986-10-01), Geldermans et al.
patent: 5007163 (1991-04-01), Pope et al.
patent: 5075965 (1991-12-01), Carey et al.
patent: 5203075 (1993-04-01), Angulas

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