Fabrication of conductor-clad composites using molding compounds

Details Fabrication of conductor-clad composites using molding compounds Fabrication of conductor-clad composites using molding compounds

1981-07-31

1983-07-12

Cannon, James C.

Stock material or miscellaneous articles

Structurally defined web or sheet

Discontinuous or differential coating, impregnation or bond

174 685, 428 64, 428361, 428431, 428457, 428458, 428482, 428901, B32B 310, H05K 100

Patent

active

043931111

ABSTRACT:
Conductor-clad composites are advantageously fabricated using molding compounds and associated processing techniques. The conductive cladding is applied and bonded to the composite during the molding process. The conductor-clad composite may be used as printed wiring board, and in this embodiment results in improved physical, chemical, mechanical, and electrical properties.

REFERENCES:
patent: 2716268 (1955-08-01), Steigerwalt
patent: 3079645 (1963-03-01), Cosmos
patent: 3085295 (1963-04-01), Pizzino et al.
patent: 3505141 (1970-04-01), Sorensen et al.
patent: 3660528 (1972-05-01), Kostenko et al.
patent: 3784664 (1974-01-01), Nicklin
patent: 3893976 (1975-07-01), Modler et al.
patent: 4012267 (1977-03-01), Klein
patent: 4023998 (1977-05-01), Cederberg et al.
Insulation/Circuits, Nov. 1976, p. 41.

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