Fabrication of components by coining

Details Fabrication of components by coining Fabrication of components by coining

1997-12-12

2000-07-04

Powell, William

Semiconductor device manufacturing: process

Chemical etching

Combined with the removal of material by nonchemical means

216 14, 216 52, 438754, H01L 2100, B44C 122

Patent

active

06083837&

ABSTRACT:
Metallic elements such as leads for connection to a semiconductor chip are made by embossing a metal sheet to form thin and thick regions, then etching or otherwise removing metal from the sheet in a nonselective removal process and arresting the removal process when the thin regions are removed but before the thick regions are removed. A base material may be applied to the metal sheet to form a dielectric layer before the removal step, so that the metallic leads left after the removal step are supported by the dielectric layer.

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