Fabrication of circuit packages using solid phase solder bonding

Details Fabrication of circuit packages using solid phase solder bonding Fabrication of circuit packages using solid phase solder bonding

1979-12-26

1982-06-01

Ramsey, Kenneth J.

Metal fusion bonding

Process

Plural joints

228188, 228193, H01L 21603

Patent

active

043323413

ABSTRACT:
A method of forming circuit packages including bonding an electronic component, (10) such as a chip carrier, to a supporting substrate (22). Solid solder preforms (13) are applied to contact members (12) on the component or substrate or both. The preforms are bonded to the contact members by heating to a temperature below the melting point of the solder while applying force to the preforms. The preforms are therefore bonded without melting, and fluxing and cleaning operations may be eliminated. The component can then be bonded to the substrate by the same solid phase technique.

REFERENCES:
patent: 3292240 (1966-12-01), McNutt et al.
patent: 3373481 (1968-03-01), Lins et al.
patent: 3504096 (1970-03-01), Nagel
patent: 3555664 (1971-01-01), Bingham et al.
patent: 3561107 (1971-02-01), Best et al.
patent: 3591839 (1971-07-01), Evans
patent: 4143385 (1979-03-01), Miyashi
Manko Solders and Soldering McGraw Hill, 1964, pp. 124-125.

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