Fabrication of circuit packages

Details Fabrication of circuit packages Fabrication of circuit packages

1979-12-26

1982-10-05

Ramsey, Kenneth J.

Metal fusion bonding

Process

Metal to nonmetal with separate metallic filler

228124, 228180A, 228246, B23K 102, H01L 2160

Patent

active

043524494

ABSTRACT:
A method of fabricating circuit packages which employ macro-components (10) mounted on supporting substrates (20). In order to maintain sufficient clearance between the component and substrate and achieve high reliability bonds, massive solder preforms (16) are applied to contact pads on either the component or substrate. After contact pads of both carrier and substrate are brought into contact with the spheres, the bond is formed.

REFERENCES:
patent: 3292240 (1966-12-01), McNutt et al.
patent: 3392442 (1968-07-01), Napier et al.
patent: 3429040 (1969-02-01), Miller
patent: 3436818 (1969-04-01), Merrin et al.
patent: 3591839 (1971-07-01), Evans
patent: 3609471 (1971-09-01), Scace et al.
patent: 3871014 (1975-03-01), King et al.
patent: 4143385 (1979-03-01), Miyoshi
Settle, "A New Family of Microelectronic Packages for Avionics", Solid State Technology, Jun. 1978, pp. 54-58.
"Manufactoring Technology for Low Cost Hermetic Chip Carrier Packaging", Third Quarterly Report, Contract F33615-78-C-5147, Wright Patterson Air Force Base, Manufactoring Techology Div., Jul. 15, 1979, p. 1 of Appendix A.
Meiksin, Thin and Thick Films for Hybrid Micro-electronics Lexington Books, Toronto, 1976, pp. 320-321.

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