Fabrication of boron sputter targets

Details Fabrication of boron sputter targets Fabrication of boron sputter targets

1993-12-06

1995-02-28

Heinrich, Samuel M.

Metal fusion bonding

Process

Metal to nonmetal with separate metallic filler

2281245, 2282628, 20419215, 20419216, B23K 3100, B23K10136, C23C 1434

Patent

active

053929810

ABSTRACT:
A process for fabricating high density boron sputtering targets with sufficient mechanical strength to function reliably at typical magnetron sputtering power densities and at normal process parameters. The process involves the fabrication of a high density boron monolithe by hot isostatically compacting high purity (99.9%) boron powder, machining the boron monolithe into the final dimensions, and brazing the finished boron piece to a matching boron carbide (B.sub.4 C) piece, by placing aluminum foil there between and applying pressure and heat in a vacuum. An alternative is the application of aluminum metallization to the back of the boron monolithe by vacuum deposition. Also, a titanium based vacuum braze alloy can be used in place of the aluminum foil.

REFERENCES:
patent: 4135286 (1979-01-01), Wright et al.
patent: 4209375 (1980-01-01), Gates et al.
patent: 5032468 (1991-07-01), Dumont et al.
patent: 5180478 (1993-01-01), Hughes
patent: 5215639 (1993-06-01), Boys

Affiliated with

Also associated with

Rating

Fabrication of boron sputter targets does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Fabrication of boron sputter targets, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Fabrication of boron sputter targets will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-842760