Fabrication of bi-level circuits

Details Fabrication of bi-level circuits Fabrication of bi-level circuits

1978-11-02

1980-03-04

Esposito, Michael F.

Coating processes

Electrical product produced

Integrated circuit, printed circuit, or circuit board

427123, 427125, 427282, 427376B, 427377, 427380, 29625, 174685, H05K 104, H05K 108

Patent

active

041917898

ABSTRACT:
Disclosed is a method of fabricating bi-level circuits which include metallization of via holes (14 and 15) in insulating subustrates (10). A thick film metal paste (13) is prepared which according to one embodiment comprises copper, glass frit and an organic vehicle including a low molecular weight ethyl cellulose binder and solvents of butyl carbitol acetate and alpha terpineol. The paste is deposited onto the substrate and through the holes. The structure is baked with the printed surface (12) down in order to establish a solvent concentration gradient in the paste which results in solid material accumulating away from the printed surface to form the contact pad (16). The material is then fired to establish the desired conductivity.

REFERENCES:
patent: 3269861 (1966-08-01), Schneble
patent: 3357856 (1967-12-01), Ragan
patent: 3647532 (1972-03-01), Friedman
patent: 4020206 (1977-04-01), Beil
patent: 4024629 (1977-05-01), Lemoine
patent: 4064290 (1977-12-01), Ebel
Kline et al., "Thick Film . . . Through Holes", 1973 Internation. Microelectronics Symposium, pp. 3A-2-1 to 3A-2-6.

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