Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Making plural separate devices
Reexamination Certificate
2006-08-31
2009-11-17
Nguyen, Ha Tran T (Department: 2829)
Semiconductor device manufacturing: process
Packaging or treatment of packaged semiconductor
Making plural separate devices
C257S787000, C257S796000, C257S695000, C257S676000
Reexamination Certificate
active
07618845
ABSTRACT:
A QFN integrated circuit is mounted on a leadframe having multiple lead lands and resin material encapsulates the integrated circuit leaving the lead lands exposed. Subsequently a sawing operation divides the lead lands into multiple leads, and the leadframe and resin material are partitioned to form packages. The pitch of the resultant leads is not limited by the pitch of the lead lands of the leadframe, so the leadframe can be of the relatively cheap generic leadframe variety, in which the pitch of the lead lands is higher than the desired pitch of the leads of the completed package. The sawing operation may further include reshaping the diepad area of the leadframe to produce heat sink fins, for improved heat dissipation. The proposed process is suitable both to produce packages including only a single integrated circuit, and also to produce multi-chip modules.
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Infineon - Technologies AG
Kusumakar Karen M
Nguyen Ha Tran T
Slater & Matsil L.L.P.
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