Fabrication of a semiconductor component element having a Schott

Metal working – Method of mechanical manufacture – Assembling or joining

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29576B, 29578, 29580, 148 15, 148187, 357 15, 357 22, 357 61, 357 71, 357 91, 427 84, H01L 21265, H01L 2948, H01L 2980

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041730631

ABSTRACT:
The invention relates to a semiconductor component element, in particular a Schottky field-effect transistor with a low series resistance, as well as a process for the production thereof.
By means of a novel masking technique, it is possible for the channel region to be implanted as well as the source and drain regions, in a single implantation step. Only one photomask is necessary. By a novel masking arrangement, only a small fraction of the radiated ions get through to the region of the substrate where the channel is to be formed. This enables the formation of a Schottky contact where the channel will be formed. The source and drain regions are formed by allowing a much higher portion of the ions to reach such regions. This allows ohmic contacts to be formed on the source and drain. Thus, in the implantation of the dopant particles, regions are formed with different layer resistances in the semiconductor substrate. The thus produced field-effect transistor has low series resistance between the ohmic contacts and the active zones, without the Schottky contact being adversely influenced. Diodes and other active components may also be produced in a similar manner.
A component element produced by the process is also disclosed which particularly finds use in the production of electronic circuits.

REFERENCES:
patent: 3653978 (1972-04-01), Robinson et al.
patent: 3739237 (1973-06-01), Shannon
patent: 3775192 (1973-11-01), Beale
patent: 3895966 (1975-07-01), MacDougall et al.
patent: 3912546 (1975-10-01), Hunsperger et al.
patent: 4029522 (1977-06-01), De La Moneda
patent: 4033788 (1977-07-01), Hunsperger et al.
patent: 4063964 (1977-12-01), Peressini et al.
DeWitt, D., "Field Effect Transistor", IBM Tech. Discl. Bull., vol. 9, No. 1, Jun. 1966, p. 102.

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