Fabrication of a printed circuit board with metal-filled channel

Details Fabrication of a printed circuit board with metal-filled channel Fabrication of a printed circuit board with metal-filled channel

1983-07-11

1985-07-30

Childs, Sadie L.

Coating processes

Electrical product produced

Integrated circuit, printed circuit, or circuit board

29848, 29849, 427 97, 427 98, 427 99, 427250, 427322, 427367, 427404, 427423, B05D 512

Patent

active

045321523

ABSTRACT:
A plastic substrate is injection molded to provide a pattern of channels in at least one of its sides to define a predetermined set of conductive paths. Both the surfaces of the channels and the non-channel surfaces therebetween are metalling through one or more steps of flame spraying, a combination of electroless plating and electroplating, gas plating or vacuum deposition. In one form of the invention the metallization over the non-channel surfaces is removed by abrading. In another form of the invention the initial metallization over the non-channel surfaces is coated with a resist prior to the deposition of another metal layer. The metal covering the channels is subsequently removed by stripping the resist and etching away the initial metallization.

REFERENCES:
patent: 2716268 (1955-08-01), Steigerwalt
patent: 2772501 (1956-12-01), Malcolm
patent: 2927043 (1960-03-01), Stetson
patent: 3081525 (1963-03-01), Delbove
patent: 3448516 (1969-06-01), Buck
patent: 3562038 (1971-02-01), Shipley et al.
patent: 3620933 (1971-11-01), Grunwald et al.
patent: 3628243 (1971-12-01), Phol et al.
patent: 3698940 (1972-10-01), Mersereau et al.
patent: 3791848 (1974-02-01), DeAngelo
patent: 4024631 (1977-05-01), Castillero
patent: 4125637 (1978-11-01), Tanner
patent: 4157407 (1979-06-01), Peiffer
patent: 4181755 (1980-01-01), Liu et al.
patent: 4217182 (1980-08-01), Cross
patent: 4263341 (1981-04-01), Martyniak
patent: 4303798 (1981-12-01), Paunovic
patent: 4374457 (1983-02-01), Wiech

Affiliated with

Also associated with

Rating

Fabrication of a printed circuit board with metal-filled channel does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Fabrication of a printed circuit board with metal-filled channel, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Fabrication of a printed circuit board with metal-filled channel will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-2372436