Fabrication of a ferromagnetic inductor core and capacitor...

Details Fabrication of a ferromagnetic inductor core and capacitor... Fabrication of a ferromagnetic inductor core and capacitor...

2006-10-10

2006-10-10

Le, Dung A. (Department: 2818)

Semiconductor device manufacturing: process

Having magnetic or ferroelectric component

C438S618000, C438S620000, C438S622000, C257S531000, C257SE21022, C257SE27046

Reexamination Certificate

active

07118925

ABSTRACT:
A method of manufacturing an integrated circuit on a semiconductor wafer. The method comprising forming a bottom plate of a capacitor50aand a bottom portion of an induction coil50a, forming an etch stop layer250′, forming a ferromagnetic capacitor top plate20aand a ferromagnetic core20b, forming a top portion of the induction coil50bplus vias50cthat couple the top portion of the induction coil50bto the bottom portion of the induction coil50c.

REFERENCES:
patent: 5793272 (1998-08-01), Burghartz et al.
patent: 6037649 (2000-03-01), Liou
patent: 2004/0245636 (2004-12-01), Cooney et al.
Kenneth D. Brennan, et al., “System for Integrating a Toroidal in a Semiconductor Device” U.S. Appl. No. 09/953,310, filed Sep. 10, 2001.
Kenneth D. Brennan, et al., “Method to Improve Inductance with a High-Permeability Slotted Plate Core in an Integrated Circuit” U.S. Appl. No. 10/906,046, filed Jul. 30, 2004.

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