Metal working – Method of mechanical manufacture – Electrical device making
Patent
1993-09-15
1995-02-14
Ramsey, Kenneth J.
Metal working
Method of mechanical manufacture
Electrical device making
29846, 228 563, 22818022, 228253, H05K 334
Patent
active
053883276
ABSTRACT:
A technique for simultaneously forming large numbers of solder ball (or bump) contacts on a surface of a substrate is described. A dissolvable film carrier is provided with holes arranged in a shape to correspond to an array of contact pads on a substrate. The holes are filled with solder. The film carrier retains the solder. The carrier is placed over the surface of the substrate and is heated, causing the solder to re-flow and to wet and to adhere to the contact pads. The carrier, which resists the re-flow temperature, maintains the shape of the solder contacts while cooling. After cooling, the film carrier can be removed from around the solder contacts with a suitable solvent.
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LSI Logic Corporation
Ramsey Kenneth J.
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