Fabrication multilayer combined rigid/flex printed circuit board

Details Fabrication multilayer combined rigid/flex printed circuit board Fabrication multilayer combined rigid/flex printed circuit board

1994-12-05

1996-04-09

Breneman, R. Bruce

Etching a substrate: processes

Forming or treating electrical conductor article

Adhesive or autogenous bonding of self-sustaining preforms

216 36, 174250, 428209, H05K 300

Patent

active

055053211

ABSTRACT:
Multilayer rigid flex printed circuits are fabricated from a novel basestock composite comprising two copper conducting sheets, bonded to insulator layers comprised of fiberglass sheets impregnated with an adhesive such as epoxy, wherein the insulator layers are both affixed to Kapton layers wherein said Kapton layers are not coextensive with the borders of the insulator layers. The basestock composite can then be imaged and etched on the conductor layers to form conductor patterns, laminated or coated with a coverlay of dielectric material, and the basestock can be cut at a point internal to its borders and into the Kapton layers thereby separating two imaged and etched conductor layers.

REFERENCES:
patent: 3409732 (1968-11-01), Dahlgren et al.
patent: 4800461 (1989-01-01), Dixon et al.
patent: 5144742 (1992-09-01), Lucas et al.

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