Fabrication method of semiconductor test piece

Details Fabrication method of semiconductor test piece Fabrication method of semiconductor test piece

1996-10-10

1998-09-29

Breneman, R. Bruce

Semiconductor device manufacturing: process

With measuring or testing

Optical characteristic sensed

438692, 216 60, H01L 2102, H01L 21304

Patent

active

058145281

ABSTRACT:
A fabrication method for a test piece for observing non-contact regions in a pair of bonded semiconductor substrates includes thinning one substrate of a pair of bonded semiconductor substrates, grade-polishing the thinned semiconductor substrate and the bonded semiconductor substrates to have a predetermined graded angle relative their bonded surfaces, and dry-etching an area around the bonded surfaces of the grade-polished semiconductor substrates to reveal faults. With the thusly fabricated test piece, micro non-contact regions can be simply observed and crystal faults existing on the bonded surfaces as well as in the micro non-contact regions can be easily detected.

REFERENCES:
"Structural Evaluation of Silicon-On-Insulation Fabricated By A Direct Wafer Bonding And Numerically Controlled Polishing Technique"; J. Elect. Soc., vol. 138, No. 8, pp. 2468-2474; Yamada et. al.; Aug. 1991.
"Recent Advances In Thinning of Bonded So I Wafers by Plasma Assited Chemical Etching"; Mumola et al.; Proceedings of The Third Internation Symposium on Semiconductor Wafer Bonding: Physics and Applications, Abstract Only (p. 28).
Yun, et al., "Studies on Microvoids at the Interface of Direct Bonded Silicon Wafers," J. Electrochem. Soc., 139:2326-2330 (Aug., 1992).

Affiliated with

Also associated with

Rating

Fabrication method of semiconductor test piece does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Fabrication method of semiconductor test piece, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Fabrication method of semiconductor test piece will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-685712