Fabrication method of semiconductor integrated circuit device

Details Fabrication method of semiconductor integrated circuit device Fabrication method of semiconductor integrated circuit device

2004-06-09

2009-06-09

Smoot, Stephen W (Department: 2813)

Semiconductor device manufacturing: process

With measuring or testing

Optical characteristic sensed

C438S017000, C257SE21525

Reexamination Certificate

active

07544522

ABSTRACT:
To prevent breakage of a membrane probe during a probe test using a probe card having the membrane probe, appearance of a main surface of a wafer as a test object is tested by an appearance tester51, and results of bad appearance such as adhesion of a foreign substance to the main surface of the wafer and abnormality in shape of bump electrodes over the main surface of the wafer are collected as wafer map data according to arrangement of respective chips in a plane of the wafer, then the wafer map data are transmitted to a probe tester53via a server52, and the probe tester53omits the probe test for chips in which bad appearance was detected, and concurrently performs the probe test to other chips in which bad appearance was not detected, based on the wafer map data.

REFERENCES:
patent: 5489538 (1996-02-01), Rostoker et al.
patent: 5644245 (1997-07-01), Saitoh et al.
patent: 6111417 (2000-08-01), Kojima
patent: 6305230 (2001-10-01), Kasukabe et al.
patent: 6391666 (2002-05-01), Huang et al.
patent: 2002/0061606 (2002-05-01), Honma et al.
patent: 2003/0122570 (2003-07-01), Byrd
patent: 2003/0222671 (2003-12-01), Cram
patent: 2006/0025956 (2006-02-01), Satake
patent: 0999451 (2000-05-01), None
patent: 1022775 (2000-07-01), None
patent: 05-003239 (1993-01-01), None
patent: 05-074888 (1993-03-01), None
patent: 06-089929 (1994-03-01), None
patent: 07-094559 (1995-04-01), None
patent: 07-142547 (1995-06-01), None
patent: 07-147304 (1995-06-01), None
patent: 07-283280 (1995-10-01), None
patent: 08-050146 (1996-02-01), None
patent: 08-201427 (1996-08-01), None
patent: 08-306748 (1996-11-01), None
patent: 10-308423 (1998-11-01), None
patent: 11-023615 (1999-01-01), None
patent: 11-097471 (1999-04-01), None
patent: 2000-150594 (2000-05-01), None
patent: 2001-159643 (2001-06-01), None
patent: 2002-163900 (2002-06-01), None
patent: WO 95/34000 (1995-12-01), None

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