Fabrication method of semiconductor integrated circuit...

Details Fabrication method of semiconductor integrated circuit... Fabrication method of semiconductor integrated circuit...

2007-09-18

2007-09-18

Nguyen, Thanh (Department: 2813)

Semiconductor device manufacturing: process

With measuring or testing

C438S048000, C257SE21001

Reexamination Certificate

active

11016925

ABSTRACT:
A probe card is formed of a main board and a sub-board located above the principal surface of the main board. The sub-board is located inside of an internal circumferential pad region of the main board. Relays are arranged in a line along the external circumference of the upper surface of the sub-board. Electrical components, such as the relays, a capacitor, a crystal-controlled oscillator, and an IC, are selected from components which are reduced in size as much as possible. The circuit for inspection is formed of the electrical components provided over the sub-board and the wiring layers within the sub-board. As a result, the yield of the probe card can be improved.

REFERENCES:
patent: 6337577 (2002-01-01), Doherty et al.
patent: 2002/0043970 (2002-04-01), Lee
patent: 2003/0098701 (2003-05-01), Tatematsu et al.
patent: 11-044709 (1999-02-01), None

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