Fabrication method of semiconductor device

Details Fabrication method of semiconductor device Fabrication method of semiconductor device

2009-05-06

2010-11-02

Wilczewski, Mary (Department: 2822)

Semiconductor device manufacturing: process

With measuring or testing

Optical characteristic sensed

C438S007000, C438S014000, C438S015000, C257SE21525

Reexamination Certificate

active

07824932

ABSTRACT:
A technique is provided which can exactly recognize a chip to be picked up when picking up the chip from a wafer sheet in a process of die bonding a thin chip. A camera is coupled to one end of a lens barrel, an objective lens is attached to an opposite end of the lens barrel, and an image of a main surface of a chip is photographed through the objective lens. A surface-emitting lighting unit, a diffusing plate and a half mirror are internally provided between the lens barrel and the chip. Further, another lens barrel having a coaxial drop lighting function of radiating light to the main surface of the chip along the same optical axis as that of the camera is disposed.

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