Fabrication method of rigid-flex circuit board

Details Fabrication method of rigid-flex circuit board Fabrication method of rigid-flex circuit board

2011-05-17

2011-05-17

Tucker, Philip C (Department: 1745)

Adhesive bonding and miscellaneous chemical manufacture

Methods

Surface bonding and/or assembly therefor

C029S825000, C216S013000, C156S247000

Reexamination Certificate

active

07942999

ABSTRACT:
A fabrication method of a rigid-flex circuit board is described as follows. Firstly, a flexible circuit board and at least a cover layer are provided. The cover layer covers a surface of the flexible circuit board. A protection layer is then formed on the cover layer. Next, a substrate is laminated to the surface of the flexible circuit board. The substrate has a conductive layer and a prepreg disposed between the conductive layer and the cover layer. The prepreg has an opening for accommodating the protection layer. Thereafter, the conductive layer is patterned for forming a patterned conductive layer. Afterwards, the protection layer is removed.

REFERENCES:
patent: 5047279 (1991-09-01), Nasu et al.
patent: 6344974 (2002-02-01), Hirata et al.
patent: 6426011 (2002-07-01), Katoh
patent: 6468439 (2002-10-01), Whitehurst et al.
patent: 2009/0026168 (2009-01-01), Tsai et al.
patent: 1304535 (2001-07-01), None
patent: 1799289 (2006-07-01), None
patent: 2006173252 (2006-06-01), None
patent: 2006173252 (2006-06-01), None
patent: 515056 (2002-12-01), None
patent: M302222 (2006-12-01), None
patent: I287957 (2007-10-01), None
Chinese First Examination Report of China Application No. 200810125673.4, dated Jul. 27, 2010.

Affiliated with

Also associated with

Rating

Fabrication method of rigid-flex circuit board does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Fabrication method of rigid-flex circuit board, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Fabrication method of rigid-flex circuit board will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-2655851