Coating processes – Direct application of electrical – magnetic – wave – or... – Polymerization of coating utilizing direct application of...
Patent
1994-09-02
1995-11-07
Pianalto, Bernard
Coating processes
Direct application of electrical, magnetic, wave, or...
Polymerization of coating utilizing direct application of...
427 96, 427259, 427264, 427265, 427270, 427271, 427272, 427282, 427331, 427404, 4274071, 427558, 427559, 427595, B05D 512
Patent
active
054646626
ABSTRACT:
A fabrication method of a printed wiring board in which the halation effect of light irradiated to a solder resist film is utilized in a process of selectively removing the solder resist film. After a conductive layer is patterned to a given circuit pattern including soldering pads, the solder resist film is formed on the base material to cover the patterned conductive layer. The solder resist film is selectively exposed to light utilizing reflection of the irradiated light from the insulating base material and developed so that the solder resist film is selectively left in areas adjacent to the respective soldering pads. Then, an etching resist film is formed to cover the patterned conductive layer except for the soldering pads, and surface areas of the respective soldering pads are selectively etched using the etching resist film as a mask to produce solder resist dams made of the solder resist film left on the base material. Solder films are formed on the respective soldering pads thus selectively etched. Electronic components can be soldered on the soldering pads with satisfactory reliability even if the soldering pads have narrow pitches such as 500 .mu.m or less.
Murakami Tomoo
Tsunoda Takanori
NEC Corporation
Pianalto Bernard
LandOfFree
Fabrication method of printed wiring board does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Fabrication method of printed wiring board, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Fabrication method of printed wiring board will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-196004