Fabrication method of printed circuit board and printed...

Details Fabrication method of printed circuit board and printed... Fabrication method of printed circuit board and printed...

2007-12-06

2011-12-13

Alanko, Anita (Department: 1713)

Etching a substrate: processes

Forming or treating electrical conductor article

C216S011000, C216S018000, C216S038000, C216S049000, C216S052000, C029S846000

Reexamination Certificate

active

08075788

ABSTRACT:
A printed circuit board fabrication method allows a fabrication time and a fabrication cost to be reduced. The fabrication method of the printed circuit board includes steps of forming a resist layer on a surface of the printed circuit board whose surface is made of an insulator, of forming a hole that is connected from the surface of the resist layer to a conductor pattern of an inner layer and a hole and grooves having a depth not connected with the conductor layer of the inner layer by irradiating lasers, of filling a conductive material into the holes and the grooves to form a conductor pattern and of removing the resist layer to project a portion of the conductor pattern out of the surface of the insulating layer.

REFERENCES:
patent: 6240636 (2001-06-01), Asai et al.
patent: 7761982 (2010-07-01), Nagase et al.
patent: 2005/0056931 (2005-03-01), Ogawa
patent: 2006/0057341 (2006-03-01), Kawabata et al.
patent: 2007/0148420 (2007-06-01), Salama et al.
patent: 2008/0052904 (2008-03-01), Schneider et al.
patent: 2008/0149379 (2008-06-01), Nagase et al.

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