Fabrication method of light emitting diode package

Details Fabrication method of light emitting diode package Fabrication method of light emitting diode package

2007-09-11

2007-09-11

Smith, Matthew (Department: 2823)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

C438S025000, C438S027000, C438S031000, C438S023000, C257S079000, C257S080000, C257S081000

Reexamination Certificate

active

11314003

ABSTRACT:
The invention provides a fabrication method of an LED package for easily fabricating LED packages of excellent heat radiation characteristics. In the method, a metallic package substrate having a recess and a reflecting surface formed in the recess is prepared, and the package substrate is selectively anodized and divided into two package electrode parts divided from each other. Then, an light emitting device is mounted on the bottom of the recess. Preferably, the package substrate is a metal substrate made of Al or Al-based metal.

REFERENCES:
patent: 6160270 (2000-12-01), Holmberg et al.
patent: 6822269 (2004-11-01), Horiuchi et al.
patent: 2005/0151142 (2005-07-01), Imai
patent: 2006/0001344 (2006-01-01), Ohkubo et al.
patent: 2003-163378 (2003-06-01), None
patent: 2003-218398 (2003-07-01), None

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