Fabrication method of a semiconductor device

Details Fabrication method of a semiconductor device Fabrication method of a semiconductor device

2007-09-18

2007-09-18

Young, Christopher G. (Department: 1756)

Radiation imagery chemistry: process, composition, or product th

Registration or layout process other than color proofing

C430S030000

Reexamination Certificate

active

11075720

ABSTRACT:
A method of fabricating a semiconductor device includes an exposure step conducted by using a reticle. The method includes the steps of exposing a first pattern on a wafer by using a first reticle having a first reticle error, and exposing a second pattern on the wafer in alignment with the first pattern by using a second reticle having a second error, wherein the step of exposing the second pattern uses a reticle having a reticle error that satisfies a requirement of critical alignment error as the second reticle, the critical alignment error being determined from a design rule applied to the wafer, the critical alignment error being further determined with reference to the first reticle error of the first reticle.

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patent: 6734971 (2004-05-01), Smith et al.
patent: 7108946 (2006-09-01), Lukanc et al.
patent: 2001-155988 (2001-06-01), None

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