Fabrication method for vacuum microelectronic devices

Details Fabrication method for vacuum microelectronic devices Fabrication method for vacuum microelectronic devices

1992-12-24

1994-03-22

Hearn, Brian E.

Fishing, trapping, and vermin destroying

437927, 148DIG50, H01L 21441

Patent

active

052964086

ABSTRACT:
A fabrication method for a microstructure having a vacuum sealed cavity therein including the process steps of forming an aluminum filled cavity in a body of silicon material and heating the structure such that the aluminum is absorbed into the silicon material leaving a vacuum in the cavity. In one embodiment of the invention a cavity is etched into a silicon wafer and filled with aluminum. A silicon dioxide layer is formed over the aluminum filled cavity and the structure is heated to produce the vacuum cavity.

REFERENCES:
patent: 4870029 (1989-09-01), Easter et al.
patent: 5011793 (1991-04-01), Obinata
patent: 5112436 (1992-05-01), Bol
patent: 5203731 (1993-04-01), Zimmerman

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