Fabrication method for semiconductor device

Details Fabrication method for semiconductor device Fabrication method for semiconductor device

2011-04-05

2011-04-05

Richards, N Drew (Department: 2895)

Semiconductor device manufacturing: process

With measuring or testing

Packaging or treatment of packaged semiconductor

C438S017000

Reexamination Certificate

active

07919336

ABSTRACT:
A semiconductor device fabrication method can improve yield of semiconductor devices and decrease (or prevent) waste of non-defective semiconductor chips. This fabrication method has a step of performing characteristic inspection after packaging a semiconductor chip every time a semiconductor chip layer is formed. The fabrication method makes another semiconductor chip layer on this semiconductor chip layer only when the inspection indicates that the semiconductor chip is a non-defective product.

REFERENCES:
patent: 6958544 (2005-10-01), Sunohara
patent: 7053475 (2006-05-01), Akagawa
patent: 7507602 (2009-03-01), Sunohara
patent: 2001/0008794 (2001-07-01), Akagawa
patent: 2002/0146859 (2002-10-01), Akagawa
patent: 2005/0212126 (2005-09-01), Sunohara
patent: 2009/0008765 (2009-01-01), Yamano et al.
patent: 2010/0052187 (2010-03-01), Lee et al.
patent: 2001-135787 (2001-05-01), None
patent: 2001-196525 (2001-07-01), None

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