Electrolysis: processes – compositions used therein – and methods – Electrolytic coating – Treating substrate prior to coating
Reexamination Certificate
1999-11-05
2001-07-17
Gorgos, Kathryn L. (Department: 1741)
Electrolysis: processes, compositions used therein, and methods
Electrolytic coating
Treating substrate prior to coating
C205S138000, C205S210000, C205S222000, C205S266000
Reexamination Certificate
active
06261436
ABSTRACT:
BACKGROUND OF THE INVENTION
The present invention relates to a method of fabricating a gold bonding wire for use in IC, LED bonding, and more particularly to such a gold bonding wire fabrication method in which pure silver wire rod or pure palladium wire rod is drawn into a wire subject to the desired thickness, and then the pure silver wire or pure palladium wire is electroplated with a layer of pure gold coating. The invention relates also to a gold bonding wire made by this method.
Regular gold bonding wires for IC bonding are directly drawn from a gold wire rod. Because these gold bonding wires are directly drawn from pure gold wire rod, their material cost is high.
SUMMARY OF THE INVENTION
It is main object of the present invention to provide a gold bonding wire fabrication method, which is practical for the fabrication of a high-quality, low-cost gold bonding wire. It is another object of the present invention to provide a gold bonding wire, which is inexpensive to manufacture. According to the present invention, pure silver or palladium wire rod is drawn into a core wire subject to the desired thickness, and the core wire is then electroplated with a layer of gold coating. After processed through an after treatment and a series of quality tests, a finished, low cost gold bonding wire is obtained.
REFERENCES:
patent: 3844909 (1974-10-01), McCary et al.
patent: 3865701 (1975-02-01), Borgmann
patent: 3873428 (1975-03-01), Winters
patent: 3905828 (1975-09-01), Barber
patent: 5679232 (1997-10-01), Fedor et al.
ASEP TEC Co., Ltd.
Dougherty & Troxell
Gorgos Kathryn L.
Leader William T.
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