Fabrication method for double metallic resist printed circuit bo

Details Fabrication method for double metallic resist printed circuit bo Fabrication method for double metallic resist printed circuit bo

1998-02-10

1999-11-09

Gorgos, Kathryn

Electrolysis: processes, compositions used therein, and methods

Electrolytic coating

Coating selected area

205920, 427 96, 427 97, C25D 502

Patent

active

059807210

ABSTRACT:
In a method to fabricate a printed circuit having a surface plated with a base metal layer, an improvement including depositing a first metallic resist on the base layer to delimit at least patterns of circuit elements to be etched in a layer having a first thickness, forming metallized holes in the plated surface after depositing the first metallic resist; and depositing a second metallic resist after forming the metallized holes to delimit at least patterns of circuit elements to be etched in a layer having a second thickness greater than said first thickness, whereby more accurate etching in the metal layer having the first thickness compared to etching in the metal layer having the second thickness is possible.

REFERENCES:
patent: 4312897 (1982-01-01), Reimann
patent: 4487654 (1984-12-01), Coppin

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