Fabrication method and structure of PCB assembly, and tool...

Details Fabrication method and structure of PCB assembly, and tool... Fabrication method and structure of PCB assembly, and tool...

2007-09-20

2010-02-23

Ward, Jessica L. (Department: 1793)

Metal fusion bonding

Including means to apply flux or filler to work or applicator

Solid flux or solid filler

C228S248100

Reexamination Certificate

active

07665648

ABSTRACT:
A fabrication method and structure for a PCBA, and tool for assembly of the structure. The structure includes a circuit board, at least one first solder joint, a plurality of second solder joints, and an electronic device. The circuit board has a solder mask, having a plurality of openings exposing at least one first pad and a plurality of second pads arranged beyond the first pad, on a surface. The first solder joint has a maximum width J1and electrically connects to the first pad. The second solder joints respectively have a maximum width J2exceeding J1and respectively electrically connect to the second pads. The electronic device has a plurality of third pads, arranged substantially corresponding to the openings, respectively electrically connecting to the first pad and second pads.

REFERENCES:
patent: 5431332 (1995-07-01), Kirby et al.
patent: 6386435 (2002-05-01), Downes
patent: 6406988 (2002-06-01), Chung
patent: 6624004 (2003-09-01), Lee
patent: 2003/0222125 (2003-12-01), Fleck et al.

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