Fabrication and structures of two-sided molded circuit modules w

Details Fabrication and structures of two-sided molded circuit modules w Fabrication and structures of two-sided molded circuit modules w

1995-12-04

1996-10-22

Bowers, Jr., Charles L.

Fishing, trapping, and vermin destroying

437209, 437217, 437219, 437220, H01L 2160

Patent

active

055676570

ABSTRACT:
First and second flexible interconnect structures are provided and each includes a flexible interconnect layer and a chip with a surface having chip pads attached to the flexible interconnect layer. Molding material is inserted between the flexible interconnect layers for encapsulating the respective chips. Vias in the flexible interconnect layers are formed to extend to selected chip pads, and a pattern of electrical conductors is applied which extends over the flexible interconnect layers and into the vias to couple selected ones of the chip pads.

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U.S. patent application, "Encased Integral Molded Plastic Multi-Chip Module Substrate and Fabrication Process" By T. B. Gorczyca, Ser. No. 08/143,519 (RD-22,756) Filed Oct. 29, 1993 Abandoned.
U.S. patent application, "A High Density Interconnected Circuit Module with a Compliant Layer as Part of a Stress-Reducing Molded Substrate", by R. J. Wojnarowski et al, Ser. No. 08/565,269 (RD-MM24214) Filed 11-320-1995. Pending.

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