Fabrication and laser deletion of microfuses

Details Fabrication and laser deletion of microfuses Fabrication and laser deletion of microfuses

1993-04-28

1994-12-20

Breneman, R. Bruce

Fishing, trapping, and vermin destroying

437922, H01L 21268

Patent

active

053745906

ABSTRACT:
A method of fabricating a microfuse, deletable by laser pulses utilizes laser pulses of a predetermined spot diameter and beam alignment accuracy. A fusible link forming a portion of the microfuse is defined such that its length is at least equal to the sum of the laser spot diameter and the beam alignment accuracy and its width is no greater than half the laser spot diameter. A method of deleting the microfuse by laser pulses is provided where the microfuse has a predetermined composition, length and width having an axis bisecting the width and parallel to the length and is covered with a passivation layer at least 3 .mu.m thick. The method includes adjusting the diameter of the beam of laser light (i) to at least a minimum diameter of W+.DELTA.P.sub.w, where W equals the width of the microfuse fuse link and .DELTA. P.sub.w equals the accuracy of the beam in the direction of W and (ii) to no more than a maximum diameter of L+.DELTA.P.sub.L, where L equals the length of the microfuse fuse link and .DELTA.P.sub.L equals the accuracy of the beam in the direction of L.

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Related U.S. patent application Ser. No. 07/990,679 filed Dec. 15, 1992 entitled "Structure and Fabrication of SiCr Microfuses" IBM Docket No. FI9-90-054.
S. Wolf et al. Silicon Processing for the VLSI ERA vol. I: Process Technology Lattice Press, Sunset Beach, Calif. 1986 pp. 407-409.

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