Fabricating surface mountable semiconductor components with...

Details Fabricating surface mountable semiconductor components with... Fabricating surface mountable semiconductor components with...

2006-02-07

2006-02-07

Chambliss, Alonzo (Department: 2814)

Semiconductor device manufacturing: process

Making device or circuit emissive of nonelectrical signal

Packaging or treatment of packaged semiconductor

C438S110000, C438S123000, C438S127000, C257S080000, C257S088000, C257S100000, C257S432000, C257S433000, C257S672000, C257S784000, C257S787000

Reexamination Certificate

active

06995029

ABSTRACT:
The invention relates to a method for producing an electrical leadframe (10), in particular for a light-emitting diode component, having at least one first electrical connection conductor (2) and at least one second electrical connection conductor (3). The method includes a) production of a layer composite comprising an electrically insulating carrier layer (101) and an electrically conductive connection conductor layer (102), b) patterning of the carrier layer (101) in such a way that at least one contact-making window (7) toward the connection conductor layer (102) is produced in said carrier layer, and c) patterning of the connection conductor layer (102), in such a way that the first electrical connection conductor (2) and the second electrical connection conductor (3) are produced, at least one of which can be electrically connected through the contact-making window (7). The invention also relates to a leadframe strip having a connection conductor layer and a connection carrier layer, on which an array with a multiplicity of component regions is formed, the connection conductor layer being at least partly removed along separating lines between two adjacent component regions.

REFERENCES:
patent: 4843280 (1989-06-01), Lumbard et al.
patent: 5156716 (1992-10-01), Parthasarathi
patent: 5976912 (1999-11-01), Fukutomi et al.
patent: 6288904 (2001-09-01), Houdeau et al.
patent: 6486543 (2002-11-01), Sano et al.
patent: 6586323 (2003-07-01), Fan et al.
patent: 196 40 304 (2000-10-01), None
patent: 100 08 203 (2001-08-01), None
patent: 100 41 328 (2002-03-01), None
patent: 10228634 (2004-01-01), None
patent: 10234978 (2004-02-01), None
patent: 0415659 (1991-03-01), None
patent: 0816925 (1998-01-01), None
patent: 1056126 (2000-11-01), None
patent: 2178231 (1987-02-01), None
patent: 04-037042 (1992-02-01), None
patent: 08-298345 (1996-11-01), None
patent: 11-126803 (1999-05-01), None
patent: 2000-049382 (2000-02-01), None
patent: WO 94/11902 (1994-05-01), None
patent: WO 02/17405 (2002-02-01), None
Fairchild Semiconductor: “Surface Mount LED Lamp, Super Bright 0402”, Fairchild Semiconductor Corporatioin, Aug. 31, 2001, pp. 1-6.
International Search Report, International Application No.: PCT/DE03/02522, Dec. 12, 2003, pp. 1-2.

Affiliated with

Also associated with

Rating

Fabricating surface mountable semiconductor components with... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Fabricating surface mountable semiconductor components with..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Fabricating surface mountable semiconductor components with... will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3702406