Fabricating semiconductor device with polysilicon protection lay

Fishing – trapping – and vermin destroying

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148DIG11, 148DIG124, 148DIG51, 148DIG117, 357 34, 357 59, 156643, 156653, 437967, H01L 21308

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046867627

ABSTRACT:
A method for making a semiconductor device having transistors comprising the active regions which are protected by polysilicon layer during the whole process from damages due to the other processing, that is dry etching, etc. and a minimized base region so as to provide a high operating speed and a minimium size thereof as well as lowest power consumption features.

REFERENCES:
IEEE Journal of Solid-State Circuits, vol. SC-20, No. 1, Feb. 1985.
IEEE Transactions on Electron Devices, vol. ED-30, No. 6, Jun. 1983.
IEEE Transaction on Electorn Device, vol. ED-28, No. 9, Sep. 1981.
IEEE Journal of Solid-State Circuits, vol. SC-14, No. 2, Apr. 1979.

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