Fabricating process for forming flexible substrate

Active solid-state devices (e.g. – transistors – solid-state diode – Incoherent light emitter structure – With reflector – opaque mask – or optical element integral...

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C349S069000

Reexamination Certificate

active

06861676

ABSTRACT:
The present invention provides a fabricating process for forming a flexible substrate, including the steps of: providing the substrate which is composed of a top plate and a bottom plate, and then a positive electrode layer and a organic electro-luminescence (EL) are formed in sequence on the bottom plate; after that, a same axial downward patterned template is pressed onto the bottom plate for “micro-patterning”, and thus the positive electrode layer and the organic electro-luminescence (EL) layer on the bottom plate are patterned in the same axial; providing a top plate, on which a metal layer as a negative electrode is formed; similarly, a same axial upper patterned template is pressed onto the top plate for “micro-patterning”, and thus the metal layer on the top plate is patterned in the same axial; finally, superimposing the top plate on the bottom plate so that the axis of patterned positive electrode layer and patterned organic EL layer crisscross with the axis of patterned metal layer to construct a chessboard-like structure.

REFERENCES:
patent: 6195142 (2001-02-01), Gyotoku et al.
patent: 6639250 (2003-10-01), Shimoda et al.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Fabricating process for forming flexible substrate does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Fabricating process for forming flexible substrate, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Fabricating process for forming flexible substrate will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-3382021

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.