Fabricating method of keypad assembly

Details Fabricating method of keypad assembly Fabricating method of keypad assembly

2007-08-28

2007-08-28

Tugbang, A. Dexter (Department: 3729)

Metal working

Method of mechanical manufacture

Electrical device making

C029S832000, C029S834000, C029S835000, C029S846000, C029S847000, C200S520000

Reexamination Certificate

active

11163983

ABSTRACT:
A keypad assembly including a substrate, a metal layer, a patterned light-shielding layer, a light-transparent material layer and a keypad circuit module is provided. Said substrate has a first surface and a second surface and the metal layer is disposed on the first surface of the substrate. In addition, the patterned light-shielding layer is disposed on the metal layer to define a light-transparent area and a light-shielding area, wherein the patterned light-shielding layer corresponds to the light-transparent area. In the meantime, the light-transparent material layer is disposed on the second surface of the substrate and corresponds to the light-transparent area. Further, the keypad circuit module is disposed on the patterned light-shielding layer.

REFERENCES:
patent: 5844166 (1998-12-01), Halttunen et al.
patent: 6284414 (2001-09-01), Okamoto
patent: 6492678 (2002-12-01), Hebert
patent: 6528824 (2003-03-01), Yamagata et al.

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