Etching a substrate: processes – Forming or treating an article whose final configuration has...
Patent
1995-07-31
1997-09-02
Kunemund, Robert
Etching a substrate: processes
Forming or treating an article whose final configuration has...
216 41, 216 57, 445 50, 445 51, H01J 130
Patent
active
056628153
ABSTRACT:
A multiple micro-tip field emission device is fabricated by forming a titanium adhesion layer under a striped tungsten cathode, etching the tungsten cathode radially using an aluminum mask and selectively etching the titanium adhesion layer, so that multiple micro-tips are formed due to the intrinsic internal stress of the tungsten itself. Thereby, the adjustment of the tip size is optionally available during the process and has excellent reproducibility since the process uses the intrinsic internal stress of the tungsten and the characteristic of a buffered oxide etching (BOE) method. Also, the output current can be controlled in a wide range from nA to mA because of the multiple micro-tips. By forming the tips with tungsten, the device has good strength, oxidation characteristics and work function and has good electrical, chemical and mechanical endurance.
REFERENCES:
patent: 3998678 (1976-12-01), Fukase et al.
patent: 5148079 (1992-09-01), Kado et al.
patent: 5220725 (1993-06-01), Chan et al.
patent: 5420054 (1995-05-01), Choi et al.
patent: 5580467 (1996-12-01), Kim
Alanko Anita
Kunemund Robert
Samsung Display Devices Co. Ltd.
LandOfFree
Fabricating method of a multiple micro-tip field emission device does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Fabricating method of a multiple micro-tip field emission device, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Fabricating method of a multiple micro-tip field emission device will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-305422