Fabricating method for printed circuit board

Metal working – Method of mechanical manufacture – Electrical device making

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C029S830000, C029S846000, C174S250000, C174S257000, C174S258000

Reexamination Certificate

active

08065797

ABSTRACT:
A method of fabricating a printed circuit board is disclosed. A method of fabricating a printed circuit board that includes: stacking an insulation layer on at least one surface of a core layer, on which an inner circuit is formed, and forming an outer circuit pattern; burying the outer circuit pattern in the insulation layer; removing the outer circuit pattern to form minute grooves and curing the insulation layer; and forming an outer circuit by filling metal in the minute grooves, makes it possible to readily form high-resolution fine-line circuits, as well as to reduce fabrication costs and increase productivity.

REFERENCES:
patent: 5426849 (1995-06-01), Kimbara et al.
patent: 5865934 (1999-02-01), Yamamoto et al.
patent: 5950306 (1999-09-01), Suzuki et al.
patent: 6085414 (2000-07-01), Swarbrick et al.
patent: 6351885 (2002-03-01), Suzuki et al.
patent: 6398561 (2002-06-01), Okuno et al.
patent: 6601297 (2003-08-01), Schmidt
patent: 6884945 (2005-04-01), Kim et al.
patent: 7134195 (2006-11-01), Sunohara et al.
patent: 7187559 (2007-03-01), Hirabayashi et al.
patent: 7197817 (2007-04-01), Takahashi et al.
patent: 7441330 (2008-10-01), Takano et al.
patent: 2002/0112879 (2002-08-01), Iwashita et al.
patent: 2003/0196833 (2003-10-01), Fujii et al.
patent: 2004/0139603 (2004-07-01), Takahashi et al.
patent: 2005/0085065 (2005-04-01), Mok et al.
patent: 2005/0132566 (2005-06-01), Roseen et al.
patent: 2006/0021791 (2006-02-01), Sunohara et al.
patent: 2007/0006435 (2007-01-01), Banerji et al.
patent: 2007/0124930 (2007-06-01), Cheng et al.
patent: 2008/0163486 (2008-07-01), Imamura et al.
patent: 2008/0186041 (2008-08-01), Lee
patent: 2008/0310132 (2008-12-01), Park et al.
patent: 2009/0014205 (2009-01-01), Kobayashi et al.
patent: 2009/0178274 (2009-07-01), Kumar

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Fabricating method for printed circuit board does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Fabricating method for printed circuit board, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Fabricating method for printed circuit board will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-4270570

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.