Fabricating method for flexible thin film transistor array...

Semiconductor device manufacturing: process – Bonding of plural semiconductor substrates – Subsequent separation into plural bodies

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C257SE21600

Reexamination Certificate

active

11306564

ABSTRACT:
A method of fabricating a flexible thin film transistor array substrate is provided. First, a rigid substrate is provided, and a polymer material layer is coated on the rigid substrate. Then, an insulating layer is coated over the polymer material layer by a spin coating process. The insulating layer covers the sides of the polymer material layer. Thereafter, a thin film transistor array is formed over the insulating layer. Then, the polymer material layer having the thin film transistor array is separated from the rigid substrate.

REFERENCES:
patent: 2003/0032210 (2003-02-01), Takayama et al.
patent: 2006/0189023 (2006-08-01), Chang et al.
patent: 2007/0059854 (2007-03-01), Huang et al.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Fabricating method for flexible thin film transistor array... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Fabricating method for flexible thin film transistor array..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Fabricating method for flexible thin film transistor array... will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-3895754

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.