Fabricating method for flexible thin film transistor array...

Details Fabricating method for flexible thin film transistor array... Fabricating method for flexible thin film transistor array...

2007-10-09

2007-10-09

Coleman, David W. (Department: 2823)

Semiconductor device manufacturing: process

Bonding of plural semiconductor substrates

Subsequent separation into plural bodies

C257SE21600

Reexamination Certificate

active

11306564

ABSTRACT:
A method of fabricating a flexible thin film transistor array substrate is provided. First, a rigid substrate is provided, and a polymer material layer is coated on the rigid substrate. Then, an insulating layer is coated over the polymer material layer by a spin coating process. The insulating layer covers the sides of the polymer material layer. Thereafter, a thin film transistor array is formed over the insulating layer. Then, the polymer material layer having the thin film transistor array is separated from the rigid substrate.

REFERENCES:
patent: 2003/0032210 (2003-02-01), Takayama et al.
patent: 2006/0189023 (2006-08-01), Chang et al.
patent: 2007/0059854 (2007-03-01), Huang et al.

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