Semiconductor device manufacturing: process – Bonding of plural semiconductor substrates – Subsequent separation into plural bodies
Reexamination Certificate
2007-10-09
2007-10-09
Coleman, David W. (Department: 2823)
Semiconductor device manufacturing: process
Bonding of plural semiconductor substrates
Subsequent separation into plural bodies
C257SE21600
Reexamination Certificate
active
11306564
ABSTRACT:
A method of fabricating a flexible thin film transistor array substrate is provided. First, a rigid substrate is provided, and a polymer material layer is coated on the rigid substrate. Then, an insulating layer is coated over the polymer material layer by a spin coating process. The insulating layer covers the sides of the polymer material layer. Thereafter, a thin film transistor array is formed over the insulating layer. Then, the polymer material layer having the thin film transistor array is separated from the rigid substrate.
REFERENCES:
patent: 2003/0032210 (2003-02-01), Takayama et al.
patent: 2006/0189023 (2006-08-01), Chang et al.
patent: 2007/0059854 (2007-03-01), Huang et al.
Leu Chyi-Ming
Tyan Horng-Long
Wong Te-chi
Wu Jian-Shu
Coleman David W.
Industrial Technology Research Institute
Jianq Chyun IP Office
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