Fabricating deeper and shallower trenches in semiconductor...

Active solid-state devices (e.g. – transistors – solid-state diode – Integrated circuit structure with electrically isolated... – Including dielectric isolation means

Reexamination Certificate

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C257S506000

Reexamination Certificate

active

07411268

ABSTRACT:
Crossing trenches of different depths may be formed in the same semiconductor structure by etching the deeper trench first. The deeper trench and the substrate may then be covered with a material that prevents further etching. The covering is etched through for the shallower trench, leaving a protective covering in the deeper trench.

REFERENCES:
patent: 5904540 (1999-05-01), Sheng et al.

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