Fabricating contacts for flexible module carriers

Metal working – Method of mechanical manufacture – Electrical device making

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174 685, 428415, H01R 4302

Patent

active

045971773

ABSTRACT:
Disclosed is a method of fabricating a novel printed circuit structure including a relatively small surface area of flexible material integral with a conventional glass epoxy carrier on which electrical contacts may be formed.

REFERENCES:
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patent: 3601523 (1971-08-01), Arndt
patent: 3955024 (1976-05-01), Goldman et al.
patent: 4076575 (1978-02-01), Chang
patent: 4080513 (1978-03-01), Cuneo et al.
patent: 4124926 (1978-11-01), Kupsky
patent: 4288916 (1981-09-01), Verma
patent: 4314002 (1982-02-01), Oizumi et al.
patent: 4353954 (1982-10-01), Yamaoka et al.
patent: 4389771 (1983-08-01), Cassidy et al.
patent: 4445952 (1984-05-01), Reynolds, III et al.
IBM Tech. Discl. Bull., vol. 11, No. 7, Dec. 1968, p. 733, by McDermott.
IBM Technical Disclosure Bulletin, vol. 14, No. 6, Nov. 1971, p. 1805, "External Pre-Lamination Via Connections in Multilayers", Crimi et al.

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