Fabricating an integrated circuit device having a vertical pnp t

Metal working – Method of mechanical manufacture – Electrical device making

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29571, 29576B, 29576E, 29576W, 29578, 29589, 29591, 148 15, 148175, 148DIG10, 357 33, 357 34, 357 44, 357 50, H01L 2174, H01L 21265

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046414193

ABSTRACT:
A process for producing semiconductor devices with a high-performance vertical pnp transistor having a high h.sub.fe and a high f.sub.T, comprising a step for forming an impurity region of a high concentration in a portion of a p-type buried layer and for increasing the concentration in a diffusion layer for isolation, a step for forming an n-type well region that reaches the p-type buried layer and that serves as a base of the vertical pnp transistor, and a step for forming an emitter of the vertical pnp transistor in a portion of said n-type well region, and for forming a collector electrode contact portion of the vertical pnp transistor, said contact portion reaching said impurity region of high concentration, by introducing p-type impurities into a portion of the p-type buried layer that serves as a portion of the collector of the vertical pnp transistor and into the p-type diffusion layer that works as an isolation layer or channel stop layer.

REFERENCES:
patent: 3930909 (1976-01-01), Schmitz et al.
patent: 3956035 (1976-05-01), Herrmann
patent: 4412376 (1983-11-01), De Bar et al.
patent: 4485552 (1984-12-01), Magdo et al.
patent: 4495010 (1985-01-01), Kranzer
patent: 4550491 (1985-11-01), Depey

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