Fabricating a tapered hole incorporating a resinous silicon...

Details Fabricating a tapered hole incorporating a resinous silicon... Fabricating a tapered hole incorporating a resinous silicon...

2005-12-06

2005-12-06

Coleman, W. David (Department: 2823)

Semiconductor device manufacturing: process

Chemical etching

Vapor phase etching

C438S725000

Reexamination Certificate

active

06972263

ABSTRACT:
A semiconductor device having reliable electrode contacts. First, an interlayer dielectric film is formed from a resinous material. Then, window holes are formed. The interlayer dielectric film is recessed by oxygen plasma. This gives rise to tapering window holes. This makes it easy to make contacts even if the circuit pattern is complex.

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Nikkei Microdevices, pp. 140-141, Nov., 1995. (English Abstract attached).

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