Fabricating a semiconductor with an insulative coating

Details Fabricating a semiconductor with an insulative coating Fabricating a semiconductor with an insulative coating

1994-12-23

1995-08-22

Hearn, Brian E.

Fishing, trapping, and vermin destroying

437 15, 437904, 437974, 437 67, 148DIG135, H01L 2900

Patent

active

054440092

ABSTRACT:
An electrical apparatus having a top and a bottom is described. A right side portion comprised of a first substrate of semiconductor material is provided. A left side portion of a second substrate of semiconductor material comprising an integrated circuit is provided. A middle portion between the right side portion and the left side portion is provided. The middle portion is comprised of an insulative coating. A metallic interconnecting structure is provided that electrically couples the first substrate of the right side portion to the integrated circuit of the left side portion. The metallic interconnecting structure extends over the insulative material of the middle portion. A top portion comprised of the insulative material is provided that covers the integrated circuit, the metallic interconnecting structure, the left side portion, the right side portion, and the middle portion. The top portion and the middle portion sandwich the metallic interconnecting structure. A substantially planar first metallic pad is provided for a first connection to external circuitry. The first metallic pad resides on the bottom of the right side portion. The first metallic pad provides a first polarity coupling to the integrated circuit. A method of fabricating the electrical apparatus is also described.

REFERENCES:
patent: 3200311 (1965-08-01), Thomas et al.
patent: 3462655 (1969-08-01), Coblenz
patent: 3559282 (1971-02-01), Lesk
patent: 3566214 (1971-02-01), Usuda
patent: 3594619 (1971-07-01), Kamoshida
patent: 3602982 (1971-09-01), Kooi
patent: 3666588 (1972-05-01), Wanesky
patent: 3680205 (1972-08-01), Kravitz
patent: 3686748 (1972-08-01), Engeler et al.
patent: 3746945 (1973-07-01), Normington
patent: 3748546 (1973-07-01), Allison
patent: 3754169 (1973-08-01), Lyon et al.
patent: 3761782 (1973-09-01), Youmans
patent: 3808470 (1974-04-01), Kniepkamp
patent: 3820235 (1974-06-01), Goldman
patent: 3886578 (1975-05-01), Eastwood et al.
patent: 3905094 (1975-09-01), Ruggiero
patent: 3944447 (1976-03-01), Magdo et al.
patent: 4063176 (1977-12-01), Milligan et al.
patent: 4250520 (1981-02-01), Denlinger
patent: 4278985 (1981-07-01), Stobbs
patent: 4577213 (1986-03-01), Bauhahn
patent: 4733290 (1988-03-01), Reardon et al.
patent: 4738933 (1988-04-01), Richards
patent: 4780424 (1988-10-01), Holler et al.
patent: 4811080 (1989-03-01), Richards
patent: 4855796 (1989-08-01), Wong et al.
patent: 4859629 (1989-08-01), Reardon et al.
patent: 4866499 (1989-09-01), Aktik
patent: 4905071 (1990-02-01), Chalifour et al.
patent: 5024966 (1991-06-01), Dietrich et al.
patent: 5034801 (1991-07-01), Fischer
patent: 5045503 (1991-09-01), Kobiki et al.
patent: 5102822 (1992-04-01), Calligaro
patent: 5117280 (1992-05-01), Adachi
patent: 5162258 (1992-11-01), Lemnios et al.
patent: 5198385 (1993-03-01), Devitt et al.
patent: 5280194 (1994-01-01), Richards et al.
Patent Cooperation Treaty Search report for International Application No. PCT/US94/03408, 7 pages (Oct. 10, 1994).
W. A. Gambling, "Microwave Semiconductor Devices," Electronic Engineering Series, pp. 105-108 (1972).
W. J. Garceau et al., "Modified Beam Lead Magnetics for Handling Semiconductors," Western Electric Technical Digest, No. 51, pp. 11-12 (Jul. 1978).
Thomas S. Laverghetta, Solid-State Microwave Devices, pp. 1-117, 178-188 (Artech House, Inc. 1987).
Joseph F. White, Ph.D., Microwave Semiconductor Engineering, pp. vii-xvii, 39-112, and 364-369 (Van Nostrand Reinhold Company, Inc. 1982).
Metalics Advertisement, p. 262 of Microwaves & RF, vol. 27, No. 5(May 1988).
M-Pulse Microwave Advertisement, pp. 8-9 of Microwaves & RF, vol. 27, No. 5 (May 1988).
M-Pulse Microwave Brochure Microwave Schottky Diodes.
M-Pulse Microwave Brochure Zero Bias Schottky Diodes.
M-Pulse Microwave Brochure Outline Dimensions.
M-Pulse Microwave Brochure PIN Diodes.
M-Pulse Microwave Brochure Hybrid Schottky Barrier Diodes.
M-Pulse Microwave Brochure Step Recovery Diodes.
M-Pulse Microwave Brochure Microwave Tunnel Diodes.
M-Pulse Microwave Brochure MNOS Chip Capacitors.
M-Pulse Microwave Brochure Techniques for Hybrid Assembly (Application Note 220).
6 sheets of drawings by Alpha Industries, Inc. that refer to "Date Feb. 12, 1990."

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