Fabricating a photonic die

Optical waveguides – Integrated optical circuit

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C438S125000

Reexamination Certificate

active

11092489

ABSTRACT:
In one embodiment, a method includes forming an array of recesses in a substrate, depositing spacer material in the recesses, forming photonic elements on the spacer material, and separating the structure previously formed into individual dies that each include a photonic element, spacer material and substrate.

REFERENCES:
patent: 6315540 (2001-11-01), Tsuruta
patent: 6588949 (2003-07-01), Zhou
patent: 6674159 (2004-01-01), Peterson et al.
patent: 6686291 (2004-02-01), Hortaleza
patent: 6960031 (2005-11-01), McFarland et al.
patent: 2002/0197025 (2002-12-01), Vaganov et al.
patent: 2003/0113074 (2003-06-01), Kohlstadt et al.
patent: 2005/0233498 (2005-10-01), Kocian et al.
patent: 2006/0030150 (2006-02-01), Jiang et al.
patent: 2006/0035415 (2006-02-01), Wood et al.
patent: 2006/0040421 (2006-02-01), Farnworth et al.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Fabricating a photonic die does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Fabricating a photonic die, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Fabricating a photonic die will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-3744113

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.