Optical waveguides – Integrated optical circuit
Reexamination Certificate
2007-05-01
2007-05-01
Pak, Sung (Department: 2874)
Optical waveguides
Integrated optical circuit
C438S125000
Reexamination Certificate
active
11092489
ABSTRACT:
In one embodiment, a method includes forming an array of recesses in a substrate, depositing spacer material in the recesses, forming photonic elements on the spacer material, and separating the structure previously formed into individual dies that each include a photonic element, spacer material and substrate.
REFERENCES:
patent: 6315540 (2001-11-01), Tsuruta
patent: 6588949 (2003-07-01), Zhou
patent: 6674159 (2004-01-01), Peterson et al.
patent: 6686291 (2004-02-01), Hortaleza
patent: 6960031 (2005-11-01), McFarland et al.
patent: 2002/0197025 (2002-12-01), Vaganov et al.
patent: 2003/0113074 (2003-06-01), Kohlstadt et al.
patent: 2005/0233498 (2005-10-01), Kocian et al.
patent: 2006/0030150 (2006-02-01), Jiang et al.
patent: 2006/0035415 (2006-02-01), Wood et al.
patent: 2006/0040421 (2006-02-01), Farnworth et al.
Bicknell Robert Newton
Chen Chien-Hua
Hewlett--Packard Development Company, L.P.
Pak Sung
Wong Tina M
LandOfFree
Fabricating a photonic die does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Fabricating a photonic die, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Fabricating a photonic die will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-3744113